Adhesives
Abstract
Kirk and Fred discuss the reliability issues around using adhesives to attach mechanical assemblies.
Key Points
Join Kirk and Fred as they discuss the use of adhesives and testing the long-term reliability of adhesive bonds.
Topics include:
- Mismatched coefficients of thermal expansion (CTE) pose a significant challenge for attaching glass, metals, and polymers.
- Epoxies that are used to encapsulate ICs in Plastic Encapsulated Microcircuits (PEM) are closely guarded formulas that match the TCE of the wire frame and leads.
- Many other factors can weaken the adhesive bond, including surface cleanliness, chemical degradation, and the differential thermal gradient between the bonded materials.
Enjoy an episode of Speaking of Reliability. Where you can join friends as they discuss reliability topics. Join us as we discuss topics ranging from design for reliability techniques to field data analysis approaches.
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Show Notes
Please click on this link to access a relatively new analysis of traditional reliability prediction methods article from the US ARMY and CALCE titled “Reliability Prediction – Continued Reliance on a Misleading Approach”. It is in the public domain, so please distribute freely. Attempting to predict reliability is a misleading and costly approach to use for developing a reliable system.
You can now purchase the most recent recording of Kirk Gray’s Hobbs Engineering 8 (two 4 hour sessions) hour Webinar “Rapid and Robust Reliability Development – 2022 HALT & HASS Methodologies Online Seminar” from this link.
For more information on the newest discovery testing methodology here is a link to the book “Next Generation HALT and HASS: Robust design of Electronics and Systems” written by Kirk Gray and John Paschkewitz.
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