Cooler Connections: Low Temp Soldering for a High-Reliability World with Indium’s Dr. Hongwen Zhang

This is the fourth of four episodes on the subject of soldering materials.

Today, we’re diving into a topic that’s reshaping how we think about thermal management, energy efficiency, and long-term performance in electronics manufacturing—low temperature soldering.
Joining me is Dr. HongWen Zhang, Principal Metallurgist and R&D Manager of the Alloy Group at Indium Corporation.

Dr. Zhang is not only a seasoned materials scientist with a Ph.D. in materials science and engineering, a Master’s degree in materials science and engineering and in mechanical engineering and a Bachelor’s degree in metallurgical physical chemistry he’s also the co-inventor of Durafuse, a groundbreaking family of solder alloys that are redefining what’s possible at low reflow temperatures—which, reportedly, does not compromise reliability.

In this episode, we’ll explore how low temperature solders are helping manufacturers lower energy consumption, protect heat-sensitive components, and still meet the rigorous mechanical and environmental demands of today’s electronics—from wearables to wafer-level packaging.

We’ll also talk about the challenges of brittleness, drop shock resistance, activation and encapsulation of no clean activators, and how cutting-edge materials research is solving problems that used to be considered trade-offs.

Whether you’re a reliability engineer, a process expert, or just solder-curious, this episode is packed with insights you won’t want to miss.

Indium’s Website:
https://www.indium.com

Durafuse ®:
https://www.indium.com/products/alloys/solder-alloys/durafuse-lt/