A Conversation about the IPC Cleanliness Standard & How to Comply with Graham Naisbitt
Today, we’re going to talk about cleanliness testing of post-reflowed circuit assemblies. In late 2018, IPC shocked the electronic assembly community by introducing an amendment to section 8 of the J-STD-001G. This amendment radically changed the way industry determines cleanliness. Now, assemblers must prove their assemblies are clean enough not to experience electro-chemical migration events which would cause the assembly to fail.
This new process of obtaining objective evidence has been met with a considerable degree of confusion. To help clear up the confusion, I invited Graham Naisbitt to be my guest. Graham is an IEC 1906 Lord Kelvin Award Winner, IEC TC91 WG2, 3 and 10 Maintenance Leader of 4 Standards.
Graham is Vice-Chair of the IPC 5-30 Cleaning and Coating Sub-Committee which oversees 15 IPC Standards Development Committees and recipient of 14 IPC Standards Awards. Graham is also a British Standards Institution EPL-501 Member.
Graham is a specialist in Surface Insulation Resistance Testing, Ionic Contamination Control, Solderability, Conformal Coating materials and application systems, Cleaning, Inspection and Test.
“Predicting Reliability in Electronics” with experts Graham Naisbitt
and Chris Hunt
“The Printed Circuit Assembler’s Guide to Process Validation”
Graham’s Contact Info: