Forging the Future of US Manufacturing with IPC’s Matt Kelly
It seems today, the entire world is experiencing supply chain challenges in nearly all product categories. In the electronic assembly industry, the focus has been within the semiconductor market, especially in North America. Why is this? How did the US allow this to occur? Was it short sightedness, greed, an over-reliance on foreign suppliers, other factors, or a combination of all these factors? What would it take to finally address this issue and are we doing anything about it?
My guest today is Matt Kelly, Chief Technologist at IPC, one of our leading industry trade organizations. IPC recently published a report on the chip shortage and, perhaps most importantly, came up with a list of 28 recommendations our industry can consider to remedy this issue. As I stated, Matt Kelly is Chief Technologist at IPC and is focused on driving next generation technology advancements and supply chain transformation across the electronics industry. He works within the association’s executive leadership team to identify and develop new strategic initiatives, meeting member and industry needs. He delivers influential thought leadership, research, and advocacy to industry and governments. He leads IPC’s Chief Technology Council to continually drive the electronics industry forward. His focus areas include Industry 4.0 – Factory of the Future digitization, modernization, adoption, and implementation; IPC expansion into new advanced packaging technologies including IC-substrates and OSAT manufacturing; and next generation electronic systems design methods.
When I first met Matt he was with IBM. Matt comes to IPC following a 15-year career at IBM Corporation, holding several senior technology and engineering leadership positions within IBM Systems Division. His technical contributions include 25 patents, 85 publications, and numerous industry awards.
Matt is a licensed Professional Engineer with a degree in Chemical Engineering from McMaster University and holds an MBA in Strategic Management from Sir Wilfrid Laurier University.
Download the referenced article from IPC: AN ANALYSIS OF THE NORTH AMERICAN SEMICONDUCTOR AND ADVANCED PACKAGING ECOSYSTEM An IPC Summary Report — Rebuilding U.S. Capabilities for the 21st Century Download Link:
More information on the upcoming IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem
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