Learning about Failures
Join Kirk and Fred as they discuss the challenge of listing potential failure mechanisms that usually occur when some mistake has been made in the design or manufacturing at some point in the supplier chain of materials and components.
- Discussing how a chip assembly process has lead to mismatch of thermal coefficient of expansion (TCE) between the lead frame and encapsulation epoxy when the epoxy formula is not correct, and this has resulted IC package failures
- Many if not most field failures are a result of a combination of multiple chemical and mechanical mechanisms, and the interactions of those mechanisms and the end use environment makes it difficult to document and record the root cause or make a glossary of failure mechanisms.
- Technology development keeps changing the potential failure mechanisms that will have to be discovered from experience of building it and finding the new mechanism,After it is discovered it can be documented and prevented in future designs, but it is always like the “Whack-a-mole” arcade game where we never know where the next failure will come from.
Enjoy an episode of Speaking of Reliability. Where you can join friends as they discuss reliability topics. Join us as we discuss topics ranging from design for reliability techniques to field data analysis approaches.
You can now purchase the recent recording of Kirk Gray’s Hobbs Engineering 8 (two 4 hour sessions) hour Webinar “Rapid and Robust Reliability Development – 2022 HALT & HASS Methodologies Online Seminar” from this link.
Please click on this link to access a relatively new analysis of traditional reliability prediction methods article from the US ARMY and CALCE titled “Reliability Prediction – Continued Reliance on a Misleading Approach”
For more information on the newest discovery testing methodology here is a link to the book “Next Generation HALT and HASS: Robust design of Electronics and Systems” written by Kirk Gray and John Paschkewitz.