Ultra HDI Panel Discussion – Recorded Live at SMTA!
Today, I’m in Rosemont Illinois at SMTAI, Surface Mount Technology International. I’m in the Ultra-HDI Pavilion on the trade show floor. And what are we going to talk about here in the Ultra-HDI pavilion? Ultra high density interconnects, of course.
As the demand for smaller, faster, and more powerful devices grows, the need for innovative solutions in circuit design has never been greater. UHDI’s represent a significant leap forward, allowing for more connections in a smaller space, pushing the boundaries of what’s possible in electronic assemblies.
But what exactly are UHDI’s? Essentially, they refer to circuit boards with incredibly fine pitch interconnects, enabling higher functionality and complexity in much smaller form factors.
This breakthrough is transforming industries like consumer electronics, aerospace, automotive, and medical devices, where space, weight, and performance are critical factors.
In this episode, we’ll explore the advantages UHDI’s bring to the table, from increased design flexibility and performance to better thermal management. We’ll also discuss how UHDI’s are set to impact the assembly process. With tighter tolerances and more intricate layouts, UHDI assemblies will require new approaches to assembly, inspection, and reliability testing.