A Conversation with Scoop’s Phil Stoten
Episode 31: A Conversation with Scoop’s Phil Stoten recorded at SMTAI in Chicago. Phil discusses Industry 4.0 and other industry-related topics.
RM 031: A Conversation with Scoop’s Phil Stoten
Reliability Matters
Reliability Matters is a podcast on the subject of reliability of circuit assemblies. Reliability "best practices" and success stories are discussed. This podcast features interviews with experts in the electronic assembly industry.
All electronic production segments which effect product reliability are on the table. This includes contamination, coating, cleanliness assessment, inspection, building for harsh environments and more.
RM 030: A Conversation About Reflow Technology with Guest David Heller
A Conversation About Reflow Technology with Guest David Heller
Episode 30: A Conversation About Reflow Technology with Heller Industries’ CEO David Heller. David joined the family business in 1987, twenty seventy years after its founding. David shares what reflow ovens were like at the beginning stages of surface mount technology and the numerous technological changes required along the way.
RM 029: A Return Conversation with Foresite’s Lead Investigator Eric Camden
A Return Conversation with Foresite’s Lead Investigator Eric Camden
Episode 29: Recorded at SMTAI in Chicago – A Return Conversation with Foresite’s Lead Investigator Eric Camden. Eric discusses his experiences in field failure analysis including the failures and causes.
RM 028: Part 2 – A Conversation with IPC’s Brook Sandy about the IPC APEX EXPO’s Technical Program
Part 2 – A Conversation with IPC’s Brook Sandy
Episode 28: Part 2 – A Conversation with IPC’s Brook Sandy about IPC APEX EXPO’s Technical Program
Register for IPC APEX EXPO here: https://ipcapexexpo2020.ipc.org
RM 027: Part 1 – A Conversation with IPC’s Brook Sandy about the IPC APEX EXPO
Part 1 – A Conversation with IPC’s Brook Sandy
Episode 27: Part 1 – A Conversation with IPC’s Brook Sandy about the IPC APEX EXPO.
Register for IPC APEX EXPO here: https://ipcapexexpo2020.ipc.org
RM 026 – An Interview with Ventec’s Technology Ambassador Alun Morgan
An Interview with Ventec’s Technology Ambassador Alun Morgan
My guest today is Alun Morgan, he is a Technology Ambassador at Ventec International Group.
Our conversation today is all about cars, and the increased reliability expectations associated with their electrical systems. The electronics in modern vehicles provide an unpresented level of safety, not just for the driver, but for those people and objects around the vehicle. Because our cars go in and out of harsh environments, the circuit assemblies within the car are subjected toheat, humidity (and other sources of moisture), which contribute to reliability and therefore safety.
We’ll discuss one of the primary failure mechanisms of circuit assemblies, an issue that can affect the operation of the safety systems within the automobile, it’s a real issue that for many is not well known.
I spoke with Alun from his office in Scotland.
Alun can be reached at alun.morgan@ventec-europe.com or through LinkedIn at https://www.linkedin.com/in/alun-morgan-04050a14/
RM 025 – An interview with Indium’s Kay Parker about SMT Printing and Being New in the Electronics Assembly Industry
An interview with Indium’s Kay Parker about SMT Printing and Being New in the Electronics Assembly Industry
An interview with Indium’s Kay Parker. We discuss SMT solder paste printing and Kay’s experience as a new engineer in the electronics assembly industry.
Kay Parker is a Technical Support Engineer based at Indium Corporation’s headquarters in Clinton, N.Y. In this role, she provides guidance and recommendations to customers related to process steps, equipment, techniques, and materials. She is also responsible for servicing the company’s existing accounts and retaining new business.
Kay first joined Indium Corporation as a college intern. During her internship, she worked alongside process engineers in Indium Corporation’s Metals and Compounds division. After graduating from the State University of New York Polytechnic Institute in 2018, Kay joined the company as a Technical Support Engineer.
At SUNY Poly, Kay earned a bachelor’s degree in applied mathematics with a minor in engineering science. Her past accomplishments include managing the details of a National Science Foundation grant, forming and leading an award-winning competitive student robotics club, developing industrial manufacturing process technologies, and modeling the flow of blood in the human eye using mathematical equations and computer programs. Kay can be reached at kparker@indium.com.
RM 024 – A Conversation with Teradyne’s Reliability Experts Mark Levin and Jon Rodin
A Conversation with Teradyne’s Reliability Experts Mark Levin and Jon Rodin
A conversation with Teradyne’s Manager of Reliability Mark Levin and Senior Software Engineering Manager Jon Bodin about reliability, DFM, and their new book “Improving Product Reliability and Software Quality: Strategies, Tools, Process and Implementation”, 2nd Edition. The book is available here: https://tinyurl.com/y2f3nhav
RM 023 – A Conversation About Testing Circuit Assemblies with Datest Founder Robert Boguski Jr.
A Conversation About Testing Circuit Assemblies with Datest Founder Robert Boguski Jr.
A conversion with Datest Founder Robert Boguski Jr. about testing circuit assemblies. The conversation covers many types of circuit testing, ethics in testing, and how to share results with customers.
RM 022 – A Conversation About Adhesion Testing with BTG Lab’s Materials Scientist Elizabeth Kidd
A Conversation About Adhesion Testing with BTG Lab’s Materials Scientist Elizabeth Kidd
On this episode, we’ll be discussing surface adhesion. What makes a surface more adherable, what makes it less adherable, and most importantly, how can one determine a surface’s adhere-ability (is that a word?) before applying a coating.
RM 021- A Conversation with Manuel Schöllig – There’s More to Clean than just Assemblies
A Conversation with Manuel Schöllig – There’s More to Clean than just Assemblies
A Conversation with Manuel Schöllig of Emil Otto, a German manufacturer of soldering and cleaning materials about cleaning stencils, pallets, fixtures, ovens, and assemblies. There’s more to clean than just circuit assemblies. Manual reviews many non-assembly cleaning requirements. Manuel also describes a new flux type that reportedly does not rely on heat activation to remove harmful flux activators.
RM 020- A Conversation with Conformal Coating Expert Phil Kinner
A Conversation with Conformal Coating Expert Phil Kinner
A conversation with Electrolube’s conformal coating expert Phil Kinner. We discuss the reasons for conformal coating and the variety of conformal coating materials available.
RM 019- A Conversation about Display Technologies and Reliability-Improving Production Methods
A Conversation about Display Technologies and Reliability-Improving Production Methods
My guests today are two of the people behind Anders, a UK-based company which manufactures displays and embedded control systems. Anders manufactures display and embedded controller products for a variety of industries including medical, marine, industrial, home, and much more. My guests are Ander’s General Manager, Paul Mullen and Display and Input Technology Manager, Mike Logan. Both Paul and Mike spoke with me from their London headquarters. Anders website is https://www.andersdx.com
RM 018 – A Conversation with Saturn Electronics’ Yash Sutariya about PCB Fabrication
A Conversation with Saturn Electronics’ Yash Sutariya about PCB Fabrication
Yash Sutariya is the President of Saturn Electronics Corporation, Saturn Flex Systems, and Saturn PCB Services, all PCB-centric operating entities. Today, we’ll discuss what every buyer of printed circuit boards should be concerned about and Yash will offer a few auditing tips that would be helpful when auditing or selecting a PCB supplier. Yash is the author of PCB RELIABILITY: AUDITING YOUR SUPPLY CHAIN TO INSURE IT, a paper he presented at SMTAI 2018.
RM 017 – A Conversation with Brian D’Amico about AOI and SPI Best Practices
A Conversation with Brian D’Amico about AOI and SPI Best Practices
My conversation with Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) system supplier Brian D’Amico covers AOI and SPI best practices. Modern circuit assemblies are difficult, if not impossible, to inspect without the aid of advanced inspection systems. Brian has been in the electronic assembly equipment industry for thirty six years. His knowledge (and passion) for inspection technology is truly impressive.
