
A common issue with solder, other than its ability to compliantly attach electronic packages to circuit boards, is its ability to fail with normal use.
Over time the normal thermal cycling causes the packages to move relative to the circuit board and the solder moves to accommodate. Each cycle the solder accumulates damage. Over time the number of cycles accumulates as does the damage. Eventually, the solder cracks and create an intermittent connection or disrupts the electron flow completely (open).













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